{"id":420749,"date":"2024-10-20T06:32:41","date_gmt":"2024-10-20T06:32:41","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-62137-42014-2\/"},"modified":"2024-10-26T12:14:41","modified_gmt":"2024-10-26T12:14:41","slug":"bs-en-62137-42014-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-62137-42014-2\/","title":{"rendered":"BS EN 62137-4:2014"},"content":{"rendered":"

This part of IEC 62137 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress.<\/p>\n

This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment.<\/p>\n

An acceleration factor for the degradation of the solder joints of the packages by the temperature cycling test due to the thermal stress when mounted, is described Annex A.<\/p>\n

Annex H provides some explanations concerning various types of mechanical stress when mounted.<\/p>\n

The test method specified in this standard is not intended to evaluate semiconductor devices themselves.<\/p>\n

\n

NOTE 1 Mounting conditions, printed wiring boards, soldering materials, and so on, significantly affect the result of the test specified in this standard. Therefore, the test specified in this standard is not regarded as the one to be used to guarantee the mounting reliability of the packages.<\/p>\n<\/blockquote>\n

\n

NOTE 2 The test method is not necessary, if there is no stress (mechanical or other) to solder joints in field use and handling after mounting.<\/p>\n<\/blockquote>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
11<\/td>\n1 Scope
2 Normative references <\/td>\n<\/tr>\n
12<\/td>\n3 Terms definitions and abbreviations
3.1 Terms and definitions
3.2 Abbreviations
4 General <\/td>\n<\/tr>\n
13<\/td>\n5 Test apparatus and materials
5.1 Specimen
5.2 Reflow soldering equipment
5.3 Temperature cycling chamber
5.4 Electrical resistance recorder
5.5 Test substrate
Figures
Figure 1 \u2013 Region for evaluation of the endurance test <\/td>\n<\/tr>\n
14<\/td>\n5.6 Solder paste
6 Specimen preparation <\/td>\n<\/tr>\n
15<\/td>\nFigure 2 \u2013 Typical reflow soldering profile for Sn63Pb37 solder alloy <\/td>\n<\/tr>\n
16<\/td>\n7 Temperature cycling test
7.1 Pre-conditioning
7.2 Initial measurement
7.3 Test procedure
Figure 3 \u2013 Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy <\/td>\n<\/tr>\n
17<\/td>\nFigure 4 \u2013 Test conditions of temperature cycling test
Tables
Table 1 \u2013 Test conditions of temperature cycling test <\/td>\n<\/tr>\n
18<\/td>\n7.4 End of test criteria
7.5 Recovery
7.6 Final measurement
8 Temperature cycling life
9 Items to be specified in the relevant product specification <\/td>\n<\/tr>\n
20<\/td>\nAnnex A (informative) Acceleration of the temperature cycling test for solder joints
A.1 General
A.2 Acceleration of the temperature cycling test for an Sn-Pb solder joint <\/td>\n<\/tr>\n
21<\/td>\nA.3 Temperature cycling life prediction method for an Sn-Ag-Cu solder joint
Table A.1 \u2013 Example of test results of the acceleration factor (Sn63Pb37 solder alloy) <\/td>\n<\/tr>\n
23<\/td>\nFigure A.1 \u2013 FBGA package device and FEA model for calculation of acceleration factors AF
Table A.2 \u2013 Example test results of the acceleration factor (Sn96,5Ag3Cu,5 solder alloy) <\/td>\n<\/tr>\n
24<\/td>\nFigure A.2 \u2013 Example of acceleration factors AF with an FBGA package device using Sn96,5Ag3Cu,5 solder alloy
Table A.3 \u2013 Material constant and inelastic strain range calculated by FEA for FBGA package devices as shown in Figure A.1 (Sn96,5Ag3Cu,5 solder alloy) <\/td>\n<\/tr>\n
25<\/td>\nA.4 Factor that affects the temperature cycling life of the solder joint
Figure A.3 \u2013 Fatigue characteristics of Sn96,5Ag3Cu,5 an alloy micro solder joint (Nf\u00a0=\u00a020\u00a0% load drop from initial load) <\/td>\n<\/tr>\n
26<\/td>\nAnnex B (informative) Electrical continuity test for solder joints of the package
B.1 General
B.2 Package and daisy chain circuit
B.3 Mounting condition and materials
B.4 Test method
B.5 Temperature cycling test using the continuous electric resistance monitoring system
Figure B.1 \u2013 Example of a test circuit for the electrical continuity test of a solder joint <\/td>\n<\/tr>\n
27<\/td>\nFigure B.2 \u2013 Measurement example of continuously monitored resistance in the temperature cycling test <\/td>\n<\/tr>\n
28<\/td>\nAnnex C (informative) Reflow solderability test method for package and test substrate land
C.1 General
C.2 Test equipment
C.2.1 Test substrate
C.2.2 Pre-conditioning oven
C.2.3 Solder paste
C.2.4 Metal mask for screen printing
C.2.5 Screen printing equipment
C.2.6 Package mounting equipment
C.2.7 Reflow soldering equipment <\/td>\n<\/tr>\n
29<\/td>\nC.2.8 X-ray inspection equipment
C.3 Standard mounting process
C.3.1 Initial measurement
C.3.2 Pre-conditioning
C.3.3 Package mounting on test substrate
Figure C.1 \u2013 Temperature measurement of specimen using thermocouples <\/td>\n<\/tr>\n
30<\/td>\nC.3.4 Recovery
C.3.5 Final measurement
C.4 Examples of faulty soldering of area array type packages
C.4.1 Repelled solder by contamination on the ball surface of the BGA package
C.4.2 Defective solder ball wetting caused by a crack in the package
Figure C.2 \u2013 Repelled solder caused by contamination on the solder ball surface <\/td>\n<\/tr>\n
31<\/td>\nC.5 Items to be given in the product specification
Figure C.3 \u2013 Defective soldering as a result of a solder ball drop <\/td>\n<\/tr>\n
32<\/td>\nAnnex D (informative) Test substrate design guideline
D.1 General
D.2 Design standard
D.2.1 General
D.2.2 Classification of substrate specifications <\/td>\n<\/tr>\n
33<\/td>\nTable D.1 \u2013 Types classification of the test substrate <\/td>\n<\/tr>\n
34<\/td>\nD.2.3 Material of the test substrate
D.2.4 Configuration of layers of the test substrate
D.2.5 Land shape of test substrate
D.2.6 Land dimensions of the test substrate
Figure D.1 \u2013 Standard land shapes of the test substrate
Table D.2 \u2013 Standard layers’ configuration of test substrates <\/td>\n<\/tr>\n
35<\/td>\nD.3 Items to be given in the product specification <\/td>\n<\/tr>\n
36<\/td>\nAnnex E (informative) Heat resistance to reflow soldering for test substrate
E.1 General
E.2 Test apparatus
E.2.1 Pre-conditioning oven
E.2.2 Reflow soldering equipment
E.3 Test procedure
E.3.1 General
E.3.2 Pre-conditioning
E.3.3 Initial measurement <\/td>\n<\/tr>\n
37<\/td>\nE.3.4 Moistening process (1)
E.3.5 Reflow heating (1)
E.3.6 Moistening process (2)
E.3.7 Reflow heating process (2)
E.3.8 Final measurement
E.4 Items to be given in the product specification <\/td>\n<\/tr>\n
38<\/td>\nAnnex F (informative) Pull strength measurement method for the test substrate land
F.1 General
F.2 Test apparatus and materials
F.2.1 Pull strength measuring equipment
F.2.2 Reflow soldering equipment
F.2.3 Test substrate
F.2.4 Solder ball
F.2.5 Solder paste
F.2.6 Flux <\/td>\n<\/tr>\n
39<\/td>\nF.3 Measurement procedure
F.3.1 Pre-conditioning
F.3.2 Solder paste printing
F.3.3 Solder ball placement
F.3.4 Reflow heating process
F.3.5 Pull strength measurement
Figure\u00a0F.1 \u2013 Measuring methods for pull strength <\/td>\n<\/tr>\n
40<\/td>\nF.3.6 Final measurement
F.4 Items to be given in the product specification <\/td>\n<\/tr>\n
41<\/td>\nAnnex G (informative) Standard mounting process for the packages
G.1 General
G.2 Test apparatus and materials
G.2.1 Test substrate
G.2.2 Solder paste
G.2.3 Metal mask for screen printing
G.2.4 Screen printing equipment
G.2.5 Package mounting equipment
G.2.6 Reflow soldering equipment
Table G.1 \u2013 Stencil design standard for packages <\/td>\n<\/tr>\n
42<\/td>\nG.3 Standard mounting process
G.3.1 Initial measurement
G.3.2 Solder paste printing
G.3.3 Package mounting
G.3.4 Reflow heating process
Figure G.1 \u2013 Example of printed conditions of solder paste <\/td>\n<\/tr>\n
43<\/td>\nG.3.5 Recovery
G.3.6 Final measurement
G.4 Items to be given in the product specification
Figure G.2 \u2013 Temperature measurement of the specimen using thermocouples <\/td>\n<\/tr>\n
44<\/td>\nAnnex H (informative) Mechanical stresses to the packages
H.1 General
H.2 Mechanical stresses
Table H.1 \u2013 Mechanical stresses to mounted area array type packages <\/td>\n<\/tr>\n
45<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Electronics assembly technology – Endurance test methods for solder joint of area array type package surface mount devices<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2015<\/td>\n48<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":420758,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-420749","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/420749","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/420758"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=420749"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=420749"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=420749"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}