🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
JIS C 60068-2-20:2010

JIS C 60068-2-20:2010

$37.05

Environmental testing – Part 2-20: Tests-Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Published By Publication Date Number of Pages
JIS 2010-05-20 23
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

This Standard outlines Test T, applicable to devices with leads.

Soldering tests for surface mounting devices (SMD) are described in JIS C 60068-2-58.

This Standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb) (heareafeter referred to as lead solder) or lead-free alloys (hereafter referred to as "lead-free solder").

The procedures in this Standard include the solder bath method and soldering iron method.

The objective of this Standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of JIS C 61191-3 and JIS C 61191-4.

In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering.

NOTE 1 Information about wetting time and wetting force can be obtained by test methods using a wetting balance.

See JIS C 60068-2-54 (solder bath method) and JIS C 60068-2-69 (solder bath and solder globule method for SMDs).

NOTE 2 The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows:

lEC 60068-2-20: 2008 Environmental testing-Part 2-20: Tests-Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IDT)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ lEC Guide 21-1.

Related products

JIS C 60068-2-20:2010
$37.05