IEC 60191-6-4:2003
$22.75
Normalisation mécanique des dispositifs à semiconducteurs – Partie 6-4: Règles générales pour la préparation des dessins d’encombrement des dispositifs à semiconducteurs à montage en surface – Méthodes de mesure pour les dimensions des boîtiers matriciels à billes (BGA)
| Published By | Publication Date | Number of Pages |
| IEC | 2003-06-11 | 36 |
| Published Code | IEC |
|---|---|
| Published By | International Electrotechnical Commission |
| Publication Date | 2003-06-11 |
| Pages Count | 36 |
| Language | France |
| Edition | 1.0 |
| File Size | 1.1 MB |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
Related products
-
BS EN 60691:2003+A2:2010
Thermal-links. Requirements and application guide Published By Publication Date Number of Pages BSI 2010 44
-
BS EN 60191-6-2:2002:2003 Edition
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60191-6-22:2013
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-8:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60191-6:2009:2010 Edition
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-5:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines…
-
BS EN IEC 60191-1:2018
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
IEC 62097:2019
Hydraulic machines, radial and axial – Methodology for performance transposition from model to prototype Published…
-
BS EN 60745-2-16:2010:2011 Edition
Hand-held motor-operated electric tools. Safety – Particular requirements for tackers Published By Publication Date Number…
-
BS EN 60691:2016+A1:2019
Thermal-links. Requirements and application guide Published By Publication Date Number of Pages BSI 2019 54
-
BS EN 60191-6-13:2016
Mechanical standardization of semiconductor devices – Design guideline of open-top-type sockets for Fine-pitch Ball Grid…
-
BS EN 60191-6-10:2003:2004 Edition
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-4:2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN IEC 60112:2020
Method for the determination of the proof and the comparative tracking indices of solid insulating…
-
BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices – Glossary of semiconductor tests and burn-in sockets for BGA,…
-
BS EN 60691:1996:2003 Edition
Thermal links. Requirements and application guide Published By Publication Date Number of Pages BSI 2003…
-
BS EN 60191-6-1:2001:2002 Edition
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices – Measurement methods of the package warpage at elevated temperature…
-
BS EN 60691:2016
Thermal-links. Requirements and application guide Published By Publication Date Number of Pages BSI 2016 50
-
BS IEC 60191-1:2007
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-3:2000
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-12:2002
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60027-1:2006+A2:2007:2009 Edition
Letter symbols to be used in electrical technology – General Published By Publication Date Number…
-
BS EN 60191-6-6:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60191-6-3:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
IEC 60191-2:1966/AMD8:2003
Amendment 8 – Mechanical standardization of semiconductor devices. Part 2: Dimensions Published By Publication Date…
-
BS EN 60191-6:2004:2005 Edition
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS 3934-6:1992
Mechanical standardization of semiconductor devices – Specification for the preparation of outline drawings of surface…
-
IEC 60191-2:1966/AMD9:2003
Amendment 9 – Mechanical standardization of semiconductor devices – Part 2: Dimensions Published By Publication…
-
BS EN 60192:2001
Low pressure sodium vapour lamps. Performance specification Published By Publication Date Number of Pages BSI…
-
BS EN 61347-2-9:2013
Lamp controlgear – Particular requirements for electromagnetic controlgear for discharge lamps (excluding fluorescent lamps) Published…
-
BS EN 60191-4:2000:2003 Edition
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines…
-
BS EN IEC 62641:2022
Conductors for overhead lines. Aluminium and aluminium alloy wires for concentric lay stranded conductors Published…
-
BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines…
-
IEC 60191-6-10:2003
Mechanical standardization of semiconductor devices – Part 6-10: General rules for the preparation of outline…
-
BS EN 60191-6-13:2007:2008 Edition
Mechanical standardization of semiconductor devices – Design guideline of open-top-type sockets for fine-pitch ball grid…
-
BS EN 62317-8:2006:2007 Edition
Ferrite cores. Dimensions – E-cores Published By Publication Date Number of Pages BSI 2007 18
-
BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices – Measurement methods of the package warpage at elevated temperature…
-
BS EN 60286-4:2013
Packaging of components for automatic handling – Stick magazines for electronic components encapsulated in packages…
