DIN EN IEC 61189-2-501:2020 Edition

$29.90

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials (Draft)

Published By	Publication Date	Number of Pages
DIN	2020-12	30

Guaranteed Safe Checkout

Categories: 31.180 - Printed circuits and boards, 31.190 - Electronic component assemblies, DIN

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

This International Standard establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determine the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

Additional information

Published Code	DIN
Published By	Deutsches Institut für Normung
Publication Date	2020-12
Pages Count	30
Language	Germany
Descriptors	Assemblies, Capacitive loads, Definitions, Dielectric, Elastic properties (fluids), Electrical components, Electrical engineering, Electronic equipment and components, Interconnection, Interconnection structures, Pressure vessels, Printed circuits, Printed-circuit boards, Resilience, Strength of materials, Stress, Testing, Testing conditions, Springiness
File Size	4.1 MB
ICS Codes	31.180 - Printed circuits and boards 31.190 - Electronic component assemblies

Preview PDF

DIN EN IEC 61189-2-501

$29.90


PDF Format	Searchable	Printable	Preview Now

DIN EN IEC 61189-2-501:2020 Edition

Related products