BSI DD IEC/PAS 61249-3-1:2007
$142.49
Materials for printed boards and other interconnecting structures – Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
| Published By | Publication Date | Number of Pages |
| BSI | 2007 | 32 |
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
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