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BS EN 60749-6:2017

BS EN 60749-6:2017

$86.31

Semiconductor devices. Mechanical and climatic test methods – Storage at high temperature

Published By Publication Date Number of Pages
BSI 2017 12
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The purpose of this part of IEC 60749 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test will need to be evaluated.

Thermally activated failure mechanisms are modelled using the Arrhenius equation for acceleration, and guidance on the selection of test temperatures and durations can be found in IEC 60749-43.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 CONTENTS
6 FOREWORD
8 1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
5.1 Test conditions
9 5.2 Measurements
5.3 Failure crieria
Table 1 ā€“ High temperature storage conditions
10 6 Summary
11 Bibliography

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BS EN 60749-6:2017
$86.31