BS EN 60749-37:2008
$102.76
Semiconductor devices. Mechanical and climatic test methods – Board level drop test method using an accelerometer
| Published By | Publication Date | Number of Pages |
| BSI | 2008 | 22 |
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
