BS EN 60191-6-13:2007:2008 Edition
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Mechanical standardization of semiconductor devices – Design guideline of open-top-type sockets for fine-pitch ball grid array and fine-pitch land grid array (FBGA/FLGA)
Published By | Publication Date | Number of Pages |
BSI | 2008 | 18 |
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IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (“FBGA” hereafter) and Fine-pitch Land Grid Array (“FLGA” hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
Status | Withdrawn |
---|---|
Title | Mechanical standardization of semiconductor devices – Design guideline of open-top-type sockets for fine-pitch ball grid array and fine-pitch land grid array (FBGA/FLGA) |
Publisher | BSI |
Committee | EPL/47 |
Pages | 18 |
Publication Date | 2008-01-31 |
Withdrawn Date | 2016-12-31 |
Replaced By | BS EN 60191-6-13:2016 |
ISBN | 978 0 580 55247 2 |
Standard Number | BS EN 60191-6-13:2007 |
Identical National Standard Of | IEC 61249-2-40:2012, EN 60191-6-13:2007, IEC 60191-6-13:2007 |
Descriptors | Drawings, Standardization, Packages, Electronic equipment and components, Integrated circuits, Semiconductor devices, Printed-circuit boards, Designations, Dimensions, Technical drawing, Engineering drawings, Symbols |
ICS Codes | 31.180 - Printed circuits and boards |
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