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BS EN 16602-60:2015

$215.11

Space product assurance. Electrical, electronic and electromechanical (EEE) components

Published By Publication Date Number of Pages
BSI 2015 102
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This standard defines the requirements for selection, control, procurement and usage of EEE components for space projects. This standard differentiates between three classes of components through three different sets of standardization requirements (clauses) to be met. The three classes provide for three levels of trade-off between assurance and risk. The highest assurance and lowest risk is provided by class 1 and the lowest assurance and highest risk by class 3. Procurement costs are typically highest for class 1 and lowest for class 3. Mitigation and other engineering measures may decrease the total cost of ownership differences between the three classes. The project objectives, definition and constraints determine which class or classes of components are appropriate to be utilised within the system and subsystems. a. Class 1 components are described in Clause 4. b. Class 2 components are described in Clause 5 c. Class 3 components are described in Clause 6. The requirements of this document apply to all parties involved at all levels in the integration of EEE components into space segment hardware and launchers. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.

PDF Catalog

PDF Pages PDF Title
11 1 Scope
12 2 Normative references
14 3 Terms, definitions and abbreviated terms
3.1 Terms from other standards
3.2 Terms specific to the present standard
15 3.3 Abbreviated terms
17 3.4 Conventions
18 3.5 Nomenclature
19 4 Requirements for Class 1 components
4.1 Component programme management
4.1.1 General
4.1.2 Components control programme
4.1.2.1 Organization
4.1.2.2 Component control plan
4.1.3 Parts control board
20 4.1.4 Declared components list
21 4.1.5 Electrical and mechanical GSE
4.2 Component selection, evaluation and approval
4.2.1 General
22 4.2.2 Manufacturer and component selection
4.2.2.1 General rules
4.2.2.2 Parts and material restriction
23 4.2.2.3 Preferred sources
4.2.2.4 Radiation hardness
24 4.2.2.5 Derating
4.2.3 Component evaluation
4.2.3.1 General
25 4.2.3.2 Component manufacturer assessment
26 4.2.3.3 Constructional analysis
4.2.3.4 Evaluation testing
27 4.2.4 Parts approval
4.3 Component procurement
4.3.1 General
28 4.3.2 Procurement specification
4.3.3 Screening requirements
29 4.3.4 Initial customer source inspection (precap)
4.3.5 Lot acceptance
30 4.3.6 Final customer source inspection (buy-off)
31 4.3.7 Incoming inspections
4.3.8 Radiation verification testing
32 4.3.9 Destructive physical analysis
33 4.3.10 Relifing
4.3.11 Manufacturer’s data documentation deliveries
34 4.4 Handling and storage
4.5 Component quality assurance
4.5.1 General
4.5.2 Nonconformances or failures
35 4.5.3 Alerts
4.5.4 Traceability
36 4.5.5 Lot homogeneity for sampling test
4.6 Specific components
4.6.1 General
4.6.2 ASICs
4.6.3 Hybrids
4.6.4 One time programmable devices
37 4.6.5 Microwave monolithic integrated circuits
4.7 Documentation
39 5 Requirements for Class 2 components
5.1 Component programme management
5.1.1 General
5.1.2 Components control programme
5.1.2.1 Organization
5.1.2.2 Component control plan
5.1.3 Parts Control Board
40 5.1.4 Declared Components List
41 5.1.5 Electrical and mechanical GSE
5.2 Component selection, evaluation and approval
5.2.1 General
42 5.2.2 Manufacturer and component selection
5.2.2.1 General rules
5.2.2.2 Parts and material restriction
43 5.2.2.3 Radiation hardness
44 5.2.2.4 Derating
5.2.2.5 Preferred sources
5.2.3 Component evaluation
5.2.3.1 General
45 5.2.3.2 Component manufacturer assessment
5.2.3.3 Constructional analysis
5.2.3.4 Evaluation testing
46 5.2.4 Parts approval
47 5.3 Component procurement
5.3.1 General
5.3.2 Procurement specification
48 5.3.3 Screening requirements
5.3.4 Initial Customer Source Inspection (precap)
5.3.5 Lot acceptance
49 5.3.6 Final customer source inspection (buy-off)
5.3.7 Incoming inspections
50 5.3.8 Radiation verification testing
51 5.3.9 Destructive physical analysis
5.3.10 Relifing
52 5.3.11 Manufacturer’s data documentation deliveries
5.4 Handling and storage
53 5.5 Component quality assurance
5.5.1 General
5.5.2 Nonconformances or failures
5.5.3 Alerts
5.5.4 Traceability
54 5.5.5 Lot homogeneity for sampling test
5.6 Specific components
5.6.1 General
5.6.2 ASICs
5.6.3 Hybrids
5.6.4 One time programmable devices
55 5.6.5 Microwave monolithic integrated circuits
5.7 Documentation
57 6 Requirements for Class 3 components
6.1 Component programme management
6.1.1 General
6.1.2 Components control programme
6.1.2.1 Organization
6.1.2.2 Component control plan
6.1.3 Parts control board
6.1.4 Declared components list
58 6.1.5 Electrical and mechanical GSE
6.2 Component selection, evaluation and approval
6.2.1 General
59 6.2.2 Manufacturer and component selection
6.2.2.1 General rules
6.2.2.2 Parts and material restriction
60 6.2.2.3 Preferred sources
6.2.2.4 Radiation hardness
61 6.2.2.5 Derating
6.2.3 Component evaluation
6.2.3.1 General
62 6.2.3.2 Component manufacturer assessment
6.2.3.3 Constructional analysis
63 6.2.3.4 Evaluation testing
6.2.4 Parts approval
64 6.3 Component procurement
6.3.1 General
6.3.2 Procurement specification
65 6.3.3 Screening requirements
6.3.4 Initial customer source inspection (precap)
6.3.5 Lot acceptance
66 6.3.6 Final customer source inspection (buy-off)
6.3.7 Incoming inspections
67 6.3.8 Radiation verification testing
6.3.9 Destructive physical analysis
68 6.3.10 Relifing
6.3.11 Manufacturer’s data documentation deliveries
6.4 Handling and storage
69 6.5 Component quality assurance
6.5.1 General
6.5.2 Nonconformances or failures
70 6.5.3 Alerts
6.5.4 Traceability
6.5.5 Lot homogeneity for sampling test
6.6 Specific components
6.6.1 Overview
6.6.2 ASICs
71 6.6.3 Hybrids
6.6.4 One time programmable devices
72 6.6.5 Microwave monolithic integrated circuits
6.7 Documentation
74 7 Quality levels
BS EN 16602-60:2015
$215.11