BS EN 16602-60:2015
$215.11
Space product assurance. Electrical, electronic and electromechanical (EEE) components
Published By | Publication Date | Number of Pages |
BSI | 2015 | 102 |
This standard defines the requirements for selection, control, procurement and usage of EEE components for space projects. This standard differentiates between three classes of components through three different sets of standardization requirements (clauses) to be met. The three classes provide for three levels of trade-off between assurance and risk. The highest assurance and lowest risk is provided by class 1 and the lowest assurance and highest risk by class 3. Procurement costs are typically highest for class 1 and lowest for class 3. Mitigation and other engineering measures may decrease the total cost of ownership differences between the three classes. The project objectives, definition and constraints determine which class or classes of components are appropriate to be utilised within the system and subsystems. a. Class 1 components are described in Clause 4. b. Class 2 components are described in Clause 5 c. Class 3 components are described in Clause 6. The requirements of this document apply to all parties involved at all levels in the integration of EEE components into space segment hardware and launchers. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.
PDF Catalog
PDF Pages | PDF Title |
---|---|
11 | 1 Scope |
12 | 2 Normative references |
14 | 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards 3.2 Terms specific to the present standard |
15 | 3.3 Abbreviated terms |
17 | 3.4 Conventions |
18 | 3.5 Nomenclature |
19 | 4 Requirements for Class 1 components 4.1 Component programme management 4.1.1 General 4.1.2 Components control programme 4.1.2.1 Organization 4.1.2.2 Component control plan 4.1.3 Parts control board |
20 | 4.1.4 Declared components list |
21 | 4.1.5 Electrical and mechanical GSE 4.2 Component selection, evaluation and approval 4.2.1 General |
22 | 4.2.2 Manufacturer and component selection 4.2.2.1 General rules 4.2.2.2 Parts and material restriction |
23 | 4.2.2.3 Preferred sources 4.2.2.4 Radiation hardness |
24 | 4.2.2.5 Derating 4.2.3 Component evaluation 4.2.3.1 General |
25 | 4.2.3.2 Component manufacturer assessment |
26 | 4.2.3.3 Constructional analysis 4.2.3.4 Evaluation testing |
27 | 4.2.4 Parts approval 4.3 Component procurement 4.3.1 General |
28 | 4.3.2 Procurement specification 4.3.3 Screening requirements |
29 | 4.3.4 Initial customer source inspection (precap) 4.3.5 Lot acceptance |
30 | 4.3.6 Final customer source inspection (buy-off) |
31 | 4.3.7 Incoming inspections 4.3.8 Radiation verification testing |
32 | 4.3.9 Destructive physical analysis |
33 | 4.3.10 Relifing 4.3.11 Manufacturer’s data documentation deliveries |
34 | 4.4 Handling and storage 4.5 Component quality assurance 4.5.1 General 4.5.2 Nonconformances or failures |
35 | 4.5.3 Alerts 4.5.4 Traceability |
36 | 4.5.5 Lot homogeneity for sampling test 4.6 Specific components 4.6.1 General 4.6.2 ASICs 4.6.3 Hybrids 4.6.4 One time programmable devices |
37 | 4.6.5 Microwave monolithic integrated circuits 4.7 Documentation |
39 | 5 Requirements for Class 2 components 5.1 Component programme management 5.1.1 General 5.1.2 Components control programme 5.1.2.1 Organization 5.1.2.2 Component control plan 5.1.3 Parts Control Board |
40 | 5.1.4 Declared Components List |
41 | 5.1.5 Electrical and mechanical GSE 5.2 Component selection, evaluation and approval 5.2.1 General |
42 | 5.2.2 Manufacturer and component selection 5.2.2.1 General rules 5.2.2.2 Parts and material restriction |
43 | 5.2.2.3 Radiation hardness |
44 | 5.2.2.4 Derating 5.2.2.5 Preferred sources 5.2.3 Component evaluation 5.2.3.1 General |
45 | 5.2.3.2 Component manufacturer assessment 5.2.3.3 Constructional analysis 5.2.3.4 Evaluation testing |
46 | 5.2.4 Parts approval |
47 | 5.3 Component procurement 5.3.1 General 5.3.2 Procurement specification |
48 | 5.3.3 Screening requirements 5.3.4 Initial Customer Source Inspection (precap) 5.3.5 Lot acceptance |
49 | 5.3.6 Final customer source inspection (buy-off) 5.3.7 Incoming inspections |
50 | 5.3.8 Radiation verification testing |
51 | 5.3.9 Destructive physical analysis 5.3.10 Relifing |
52 | 5.3.11 Manufacturer’s data documentation deliveries 5.4 Handling and storage |
53 | 5.5 Component quality assurance 5.5.1 General 5.5.2 Nonconformances or failures 5.5.3 Alerts 5.5.4 Traceability |
54 | 5.5.5 Lot homogeneity for sampling test 5.6 Specific components 5.6.1 General 5.6.2 ASICs 5.6.3 Hybrids 5.6.4 One time programmable devices |
55 | 5.6.5 Microwave monolithic integrated circuits 5.7 Documentation |
57 | 6 Requirements for Class 3 components 6.1 Component programme management 6.1.1 General 6.1.2 Components control programme 6.1.2.1 Organization 6.1.2.2 Component control plan 6.1.3 Parts control board 6.1.4 Declared components list |
58 | 6.1.5 Electrical and mechanical GSE 6.2 Component selection, evaluation and approval 6.2.1 General |
59 | 6.2.2 Manufacturer and component selection 6.2.2.1 General rules 6.2.2.2 Parts and material restriction |
60 | 6.2.2.3 Preferred sources 6.2.2.4 Radiation hardness |
61 | 6.2.2.5 Derating 6.2.3 Component evaluation 6.2.3.1 General |
62 | 6.2.3.2 Component manufacturer assessment 6.2.3.3 Constructional analysis |
63 | 6.2.3.4 Evaluation testing 6.2.4 Parts approval |
64 | 6.3 Component procurement 6.3.1 General 6.3.2 Procurement specification |
65 | 6.3.3 Screening requirements 6.3.4 Initial customer source inspection (precap) 6.3.5 Lot acceptance |
66 | 6.3.6 Final customer source inspection (buy-off) 6.3.7 Incoming inspections |
67 | 6.3.8 Radiation verification testing 6.3.9 Destructive physical analysis |
68 | 6.3.10 Relifing 6.3.11 Manufacturer’s data documentation deliveries 6.4 Handling and storage |
69 | 6.5 Component quality assurance 6.5.1 General 6.5.2 Nonconformances or failures |
70 | 6.5.3 Alerts 6.5.4 Traceability 6.5.5 Lot homogeneity for sampling test 6.6 Specific components 6.6.1 Overview 6.6.2 ASICs |
71 | 6.6.3 Hybrids 6.6.4 One time programmable devices |
72 | 6.6.5 Microwave monolithic integrated circuits 6.7 Documentation |
74 | 7 Quality levels |