{"id":458000,"date":"2024-10-20T09:54:21","date_gmt":"2024-10-20T09:54:21","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-tr-60068-3-152024\/"},"modified":"2024-10-26T18:24:38","modified_gmt":"2024-10-26T18:24:38","slug":"bsi-pd-iec-tr-60068-3-152024","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-tr-60068-3-152024\/","title":{"rendered":"BSI PD IEC TR 60068-3-15:2024"},"content":{"rendered":"

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
4<\/td>\nCONTENTS <\/td>\n<\/tr>\n
6<\/td>\nFOREWORD <\/td>\n<\/tr>\n
8<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
9<\/td>\n1 Scope
2 Normative references
3 Terms and definitions
4 Voids in solder joints
4.1 Type of voids <\/td>\n<\/tr>\n
10<\/td>\n4.2 Reasons for voids
Figures
Figure 1 \u2013 X-Ray examples of voids in solder joints in different SMD-Components
Figure 2 \u2013 Reduction of voids with low flux soldering & preforms <\/td>\n<\/tr>\n
11<\/td>\n4.3 Influence of voiding on solder joint performance
5 Vacuum-assisted soldering processes
5.1 Purpose
5.2 Combination of soldering process with vacuum <\/td>\n<\/tr>\n
12<\/td>\n5.3 Typical temperature-pressure-time curves
5.3.1 Convection soldering with vacuum
Figure 3 \u2013 Example of a product for vacuum-assisted soldering processes
Tables
Table 1 \u2013 Combination of soldering processes with vacuum <\/td>\n<\/tr>\n
13<\/td>\n5.3.2 Vapour phase soldering with vacuum
Figure 4 \u2013 Typical profile \u2013 vacuum-assisted convection soldering <\/td>\n<\/tr>\n
14<\/td>\n5.3.3 Contact soldering with vacuum
Figure 5 \u2013 Typical profile \u2013 vacuum-assisted vapour phase soldering <\/td>\n<\/tr>\n
15<\/td>\n6 Effect of vacuum when reflow soldering
6.1 General
6.1.1 General description
6.1.2 Physical basics
Figure 6 \u2013 Typical profile \u2013 vacuum-assisted contact soldering <\/td>\n<\/tr>\n
16<\/td>\n6.1.3 Vacuum parameters
6.1.4 Vapour phase vacuum reflow soldering <\/td>\n<\/tr>\n
17<\/td>\n6.2 Components in the vacuum reflow soldering process
6.2.1 Influence of pressure differences
Figure 7 \u2013 Vapour pressure curve of Galden\u00ae <\/td>\n<\/tr>\n
18<\/td>\nFigure 8 \u2013 Pressures to be considered <\/td>\n<\/tr>\n
19<\/td>\nFigure 9 \u2013 Vapour pressure curve of water
Table 2 \u2013 Molar mass <\/td>\n<\/tr>\n
20<\/td>\n6.2.2 Influence of temperature, time, and vacuum
7 Vacuum equipment restrictions
7.1 General
7.2 Chamber size <\/td>\n<\/tr>\n
21<\/td>\n7.3 Time to reach vacuum level
7.4 Cycle time
7.5 Summary
Table 3 \u2013 Combination of soldering processes with vacuum <\/td>\n<\/tr>\n
22<\/td>\n8 Typical defects after vacuum-assisted reflow soldering
8.1 Typical defect modes occurring at components
Figure 10 \u2013 Blow Hole Void in\/out of metallization
Figure 11 \u2013 Gas bubbles at metallization interface <\/td>\n<\/tr>\n
23<\/td>\nFigure 12 \u2013 Gas bubble caused by residues in metallization defect
Figure 13 \u2013 Blow out void in solder meniscus <\/td>\n<\/tr>\n
24<\/td>\nFigure 14 \u2013 Aluminium electrolytic capacitors with non-solid electrolyte, bulged
Figure 15 \u2013 Composite housing bursts in case of overpressure <\/td>\n<\/tr>\n
25<\/td>\nFigure 16 \u2013 Housing mainly made of plastic bursts in case of overpressure
Figure 17 \u2013 Relay lock (polymer dot) blown off <\/td>\n<\/tr>\n
26<\/td>\n8.2 Component defect modes \u2013 summary
8.3 Soldering defect modes
8.3.1 Dropping of components
Figure 18 \u2013 Housing with adhesive joint bursts in case of overpressure <\/td>\n<\/tr>\n
27<\/td>\n8.3.2 Bridging
8.3.3 Splattering
Figure 19 \u2013 An example of bridging on BGA during vacuum assisted soldering
Figure 20 \u2013 Optimization with stepwise applying of vacuum to reduce bridging <\/td>\n<\/tr>\n
28<\/td>\nFigure 21 \u2013 Splattering due to explosive outgassing from the solder joint <\/td>\n<\/tr>\n
29<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Environmental testing – Supporting documentation and guidance.\u00a0Vacuum-assisted reflow soldering<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2024<\/td>\n30<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":458011,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-458000","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/458000","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/458011"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=458000"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=458000"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=458000"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}